TB Series

Features

- High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.

- Different types with the same shape are available.

- Excellent in physical properties, such as terminal strength, flexure strenth, soldering resistance and solderability.

- Applicable to both flow and reflow soldering.

- High impedance cover wide frequency ranges.

 

Applications

- Computers and peripheral devices, personal computers, VCR and cameras.

- Noise suppression in digital equipments, car stereo, car engines controllers and OA electronic instruments.

- Communication equipment

 

Product Identifications

 

Shapes and Dimensions / Recommended PC Board Pattern

 

TI Series (Large Current)

Features

- High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.

- Different types with the same shape are available.

- Excellent in physical properties, such as terminal strength, flexure strenth, soldering resistance and solderability.

- Applicable to both flow and reflow soldering.

- High impedance cover wide frequency ranges.

- TI Series can be used in high current circuits due to its low DC resistance.

 

Applications

- Computers and peripheral devices, personal computers, VCR and cameras.

- Noise suppression in digital equipments, car stereo, car engines controllers and OA electronic instruments.

- Communication equipment

 

Product Identifications

 

Shapes and Dimensions / Recommended PC Board Pattern