TB Series
Features
- High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.
- Different types with the same shape are available.
- Excellent in physical properties, such as terminal strength, flexure strenth, soldering resistance and solderability.
- Applicable to both flow and reflow soldering.
- High impedance cover wide frequency ranges.
Applications
- Computers and peripheral devices, personal computers, VCR and cameras.
- Noise suppression in digital equipments, car stereo, car engines controllers and OA electronic instruments.
- Communication equipment
Product Identifications
Shapes and Dimensions / Recommended PC Board Pattern
TI Series (Large Current)
Features
- High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.
- Different types with the same shape are available.
- Excellent in physical properties, such as terminal strength, flexure strenth, soldering resistance and solderability.
- Applicable to both flow and reflow soldering.
- High impedance cover wide frequency ranges.
- TI Series can be used in high current circuits due to its low DC resistance.
Applications
- Computers and peripheral devices, personal computers, VCR and cameras.
- Noise suppression in digital equipments, car stereo, car engines controllers and OA electronic instruments.
- Communication equipment
Product Identifications
Shapes and Dimensions / Recommended PC Board Pattern